Editor-in-Chief: YongAn Huang
Submission to first decision: 33 days

Soft Science

Soft Science Expert Interview Series -Prof. Ting Lei

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Articles

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Construction and application of thermogalvanic hydrogels

Open Access Review Article DOI: 10.20517/ss.2024.59 30 Dec 2024
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State of the art and prospects in metal-organic framework-derived microwave absorption materials

Open Access Perspective DOI: 10.20517/ss.2024.63 23 Dec 2024
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Dual magnetic particles modified carbon nanosheets in CoFe/Co@NC heterostructure for efficient electromagnetic synergy

Open Access Research Article DOI: 10.20517/ss.2024.51 29 Nov 2024
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Micro-cylindrical/fibric electronic devices: materials, fabrication, health and environmental monitoring

Open Access Review Article DOI: 10.20517/ss.2024.53 28 Nov 2024
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Textile electronics for ubiquitous health monitoring

Open Access Review Article DOI: 10.20517/ss.2024.37 27 Nov 2024
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Wearable electronics for skin wound monitoring and healing

Open Access Review Article DOI: 10.20517/ss.2022.13 29 Jun 2022
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Recent progress in flexible piezoelectric devices toward human-machine interactions

Open Access Review Article DOI: 10.20517/ss.2022.23 18 Dec 2022
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Morphing matter: from mechanical principles to robotic applications

Open Access Review Article DOI: 10.20517/ss.2023.42 31 Oct 2023
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Revolutionizing Bioelectronics: Dr. Ting Lei's Innovative Semiconductor Hydrogels
November 5, 2024, marked a significant moment for Soft Science as Elsevier officially released the latest 2024 CiteScore™ metrics: Soft Science achieved an impressive CiteScore of 6.0, a remarkable rise from 4.8 just last month.
Top 10 Highlighted Articles from Soft Science in the first half of 2024, these articles cover innovative advances across wearable sensors, flexible thin films, and electronic textiles.
Guest Editors:
Prof. Hongjing Wu
Assoc. Prof. Jin Wu
Assoc. Prof. Yan Wang

Soft Science Expert Interview Series -Prof. Ting Lei

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Soft Science
ISSN 2769-5441 (Online)
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