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Figure 3. Representative material platforms for structural and encapsulation layers in organ-specific bioelectronics. (A) Representative non-degradable substrate and encapsulation materials; (B) Parylene-C-based planarization and device integration for flexible electronics[35]. Copyright © 2025, published by Springer Nature; (C) Parylene-C-based magnetic implant for wireless sensing[36]. Copyright © 2024, the American Association for the Advancement of Science; (D) Representative elastomeric and stretchable structural materials; (E) Stretchable bioelectronics with conductive hydrogels for low-impedance tissue interfaces[43]. Copyright © 2024, the American Association for the Advancement of Science; (F) Photo-patternable elastomeric substrates based on Ecoflex for stretchable bioelectronics[50]. Copyright © 2023, published by Springer Nature; (G) Representative biodegradable and bioresorbable structural materials. Created by the authors; (H) GelMA/CaA hollow microfiber assemblies as gelatin-derived biodegradable hydrogel microsystem[64]. Copyright © 2024, WILEY-VCH Verlag GmbH & Co. KGaA; (I) Silk fibroin-based ionic hydrogel fibers as biodegradable structural and conductive materials[56]. Copyright © 2024, published by Springer Nature. PI: Polyimide; PEN: polyethylene naphthalate; LCPs: liquid crystal polymers; OLED: organic light-emitting diode; PDMS: polydimethylsiloxane; PU: polyurethane; TPU: thermoplastic polyurethane; UV: ultraviolet; PLA: polylactic acid; PLGA: poly(lactic-co-glycolic acid).
