fig9

From: Flexible circuits engineered for complex and extreme environments

Figure 9. 3D printing techniques for curved structure fabrication and multifunctional device integration in flexible electronics. (A) Curved layer vs. flat layer for conductive polymers^[164]; (B) Curved layer part produced by modified Fab@home rapid prototyping machine, and curved layer part produced by the National University of Singapore machine^[164]; (C) Simplified schematics depicting the process of graphene-based 3D printing using the technique of FDM^[165]; (D) Fully-printed, flexible, and hysteresis-free CNT-TFTs^[166]; (E) Lathe AJP for smart catheter functionalization^[167]. 3D: Three-dimensional; FDM: fused deposition modeling; CNT-TFTs: carbon nanotube thin-film transistors; AJP: aerosol jet printing; PLA: polylactic acid; PLL: poly-L-lysine; SWCNTs: single-walled carbon nanotubes; IPA: isopropyl alcohol; ACE: acetone; PDMS: polydimethylsiloxane.