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Self-stratified stretchable passive cooling interface for thermal management of on-skin electronics

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Soft Sci 2026;6:[Accepted].
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Abstract

Heat accumulation from Joule heating and solar irradiation severely challenges thermal safety and signal stability of long-term, outdoor on-skin electronics and human-machine interfaces. Here, we develop a self-stratified stretchable passive cooling interface (SPCI) that implements a synergistic internal-dissipation and external-blocking strategy by inducing gradient stratification via the density mismatch between Al2O3 microparticles and liquid metal (LM) within the elastomer. This mismatch triggers spontaneous self-stratification upon curing, yielding a multi-layer composite that features an Al2O3-enriched top layer for high solar reflectance (92.6%) and an LM-network-enriched bottom layer for efficient heat dissipation (thermal conductivity ≈ 1.5 W m⁻¹ K⁻¹), while retaining soft mechanics (elastic modulus ≈ 0.082 MPa) and high stretchability (> 800% elongation). The SPCI exhibits excellent cooling performance in serpentine circuits at 200 mW, reducing peak temperature by up to 8.4 °C indoors and 12 °C outdoors under solar exposure, while maintaining effective cooling under tension. When integrated into a wireless skin-interfaced photoplethysmography (PPG) platform for heart-rate monitoring, it lowers the maximum surface temperature by 8.6 °C during outdoor operation, enabling superior preservation of pulse-wave features compared with conventional elastomer encapsulation. This work establishes a scalable, mechanically compliant encapsulation interface for simultaneously mitigating internal and external thermal loads in wearable electronics and human-machine interfaces.

Keywords

Passive cooling interface, liquid metal, radiative cooling, flexible electronics, thermal management, photoplethysmography

Cite This Article

Sun J, Liu M, Jiang C, Cai Q, Cai R, Li J, Xiao Y, Xian Q, Sun X, Jiang L, Li C, Tso CY, Yu X, Zhou Y, Peng Z, Li J. Self-stratified stretchable passive cooling interface for thermal management of on-skin electronics. Soft Sci 2026;6:[Accept]. http://dx.doi.org/10.20517/ss.2026.33

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© The Author(s) 2026. Open Access This article is licensed under a Creative Commons Attribution 4.0 International License (https://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, sharing, adaptation, distribution and reproduction in any medium or format, for any purpose, even commercially, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made.
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ISSN 2769-5441 (Online)

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