fig1
Figure 1. Roadmap of binder evolution for Si-based anodes. Conventional PVDF binders (2000-Present) exhibit high chemical stability but suffer from weak adhesion and poor elasticity. CMC/SBR systems (2005-Present) introduce water-based processing and improved adhesion, though stability is limited to low Si content. PAA binders (2010-Emerging) provide strong Si adhesion via -COOH anchoring and enable higher Si loading. Hybrid systems (2015-Future/End) feature cross-linked/branched architectures with improved toughness, self-healing behavior, and scalability toward industrial applications. The original figure was created by the authors.








