fig7

Numerical simulation and twinning evolution mechanism of the deep through silicon via electroplated copper

Figure 7. TEM results of twins with a stepped morphology partially extending through the grain: (A) BF image; (B) HRTEM image; (C) IFFT image of the region marked by the white square in (B); (D) structural distribution map of (B); (E-H) FFT images of the regions marked by white circles 1-4 in (B). BF: Bright field; HRTEM: high-resolution transmission electron microscopy; IFFT: inverse fast Fourier transform; FFT: fast Fourier transform; ITB: incoherent twin boundary; GB: grain boundary; SF: stacking fault; ZA: zone axis; M: matrix.

Microstructures
ISSN 2770-2995 (Online)

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