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From:  Deformation analysis of harmonic structured high-entropy CrMnFeCoNi alloy during in-situ tensile tests using micro-digital image correlation
Deformation analysis of harmonic structured high-entropy CrMnFeCoNi alloy during <i>in-situ</i> tensile tests using micro-digital image correlation

Figure 3. FEA model for Harmonic compact. FEA: Finite element analysis; DIC: digital image correlation; EBSD: electron backscatter diffraction.

Microstructures
ISSN 2770-2995 (Online)
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